Product Display

3D Automatic Optical Inspection(3D AOI)

3D Automatic Optical Inspection(3D AOI)

The common defects encountered in welding production are tested based on optical principles.

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Solder Paste Inspection(SPI)

Solder Paste Inspection(SPI)

Use optical principles and triangulation to check the status of printed solder paste.

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Automatic Laser Engraving

Automatic Laser Engraving

Based on the intelligent control of Industry 4.0, the unique code ensures data traceability.

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High Speed Dispenser Series

High Speed Dispenser Series

After the sensor senses that the product enters the work area, the CCD positions the product.

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WHY CHOOSE US?

Research Ability

The company has established an independent R&D center with a focus on hardware and software development and decades of industry experience and extensive theoretical and practical experience.

Team Collaboration

The company focuses on talent training and two-way (technical and management) career development channels to leverage the high performance of each member of the team.

Manufacturing

The Group has its own sheet metal, precision machinary production to ensure process quality and delivery advantages.

Service

We have 7*24H hotline 400 6129 299 for overseas online question diagnosis and resolution. One year warranty and lifelong maintenance for all the customer.

Supply Chain

Whole process of quality management, determine all reasonable requirements of customers, effectively and comprehensively meet internal quality management requirements and market quality requirements.

WELCOME TO <span>INSUN</span>

WELCOME TO INSUN

Shenzhen Insun Intelligent Technology Co., Ltd. is a precision and intelligent high-tech enterprise which specializes in the research, manufacture and sale of high-end intelligent 3D detection technology (AOI, SPI), Semiconductor detection technology, Laser intelligent application technology, High-speed dispenser and Industrial robot integration technology.
The core technologies include: Automatic optical inspection for semiconductor chip packaging, COF carrier fine lines, Integrated circuit surface printing and mounting and other related fields, advanced laser engraving technology and application, etc.

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